Newest Addition to the DFM Manual Family: Spanish!
We are excited to announce that the much-awaited Spanish version of the Design for Manufacture
pcb dfm
Top 3 Tips for Dissipating Heat in PCB design
I still remember that in my junior year, my team and I participated in a
76.8 Times Smaller than 0805 – Take a Look at 008004
Murata Manufacturing Co., Ltd. started mass production of multilayer ceramic capacitors with the smallest size
Appendix – PCB DFM 14
Extracted from the Seeed Fusion Design for Manufacture (DFM) publication, this tid-bit of information is
Files for Manufacture Requirements – PCB DFM 13
13.1 Naming Requirements for Assembly Files [108] Requires board name, version, panelization description and version
Surface Treatment – PCB DFM 12
12.1 Hot Air Solder Leveling (HASL) 12.1.1 Process Requirements [103] The PCB is covered with
Fiducial Mark Structure – PCB DFM 11
11.2.1 Panel Fiducial Marks and Image Fiducial Marks [97] Size/Shape: a solid filled circle with
PCB Dimensions Specification – PCB DFM Part 10
10.1 Manufactured PCB Dimensions [90] The range of dimensions allowed for each type of PCB
PCB Lamination Structure – PCB DFM Part 9
Layer Structure [86]The foil stacking structure is recommended. Description: For PCB lamination, there are generally
Silkscreen Design – PCB DFM Part 8
8.1 Silkscreen Design Considerations [77] General Requirements The width of the silkscreen line should be
FREE PCB DFM Manual V1.1 Available In Seeed Fusion
Dear Fusion Users, Thank you for all your feedback. We are pleased to announce that
Copper Trace Design – PCB DFM Part 7
7.1 Trace Width, Spacing and Routing Requirements [65] The width and spacing of copper traces