• Board functionality

• Memory Unit

• Sensor, Actuator, and Connector Integration

• Schematic Design

• PCB Layout

• Creating BOMs & sourcing

• Expansions: Cape, Shield, Hats

-Over Molding

-Die Pressing

• Board functionality

• Memory Unit

• Sensor, Actuator, and Connector Integration

• Schematic Design

• PCB Layout

• Creating BOMs & sourcing

• Expansions: Cape, Shield, Hats

• Hardware Drivers

• Linux Kernel Customization

• Firmware and Image Design

• Design for Manufacturing

• Mechanical Design

(2D, 3D design file and CMF)

• Molding Design

-Injection Molding

-Over Molding

-Die Pressing

-Vacuumn Casting

-Silicon Molding

• Mock up verification

• Various material available:

Plastic/Aluminum/Rubber/Silicon, etc.

• Packaging Design

• Graphic Design for Guide Books

• Graphic Design for the Manual

• Customized Packaging Design

• Graphic Design for Box, Guide books, Manuals, etc.

• Functionality Testing

• Reliability Testing

-Thermal Shock Chamber (-55/+125°C)

-High Temperature Storage Chamber

-Humidity Chamber (RH% from 20% to 95%)

-Ionic Contamination

-Strain gage

-Dye and Pry

-Cross Section

-Pull and Shear Test

• Regulatory Testing

-EMC

-EMI

-ESD

• CE

• FCC

• TELEC

• RoHS

• REACH

• CA65

• Integrated QMS

• Engineering System

• Delivery Process

• Reliability Testing

• Certification