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Appendix – PCB DFM 14
Extracted from the Seeed Fusion Design for Manufacture (DFM) publication, this tid-bit of information is
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Files for Manufacture Requirements – PCB DFM 13
13.1 Naming Requirements for Assembly Files [108] Requires board name, version, panelization description and version
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Surface Treatment – PCB DFM 12
12.1 Hot Air Solder Leveling (HASL) 12.1.1 Process Requirements [103] The PCB is covered with