PCB Dimensions Specification – PCB DFM Part 10
10.1 Manufactured PCB Dimensions
[90] The range of dimensions allowed for each type of PCB construction is shown in table 11.
Figure 55: PCB dimensions description.
Table 11: PCB dimensions and weight requirements.
[91] Required PCB width-to-thickness ratio = Y / Z 150.
[92] Required PCB length-to-width ratio = X / Y 2.
[93] For board thicknesses of less than 0.8mm, the copper foil of should be evenly distributed to prevent board bending. If there are many small boards, use of a fixture is recommended.
[94] If the primary side does not meet the clearance area requirements, then the addition of a margin of a width
greater than 5mm, along the direction of travel is recommended.
Figure 56: PCB minimum margin dimensions.
[95] The body of components must not exceed past the edge of the PCB, and must satisfy the following:
The minimum distance from the edge of the solder pad (or component body) to the primary side
must be less than 5mm.
For non-reflow soldering, when a component protrudes out from the PCB, the width of the margin
is as follows:
Figure 57: Protruding component margin requirements.
For non-reflow soldering, when a component protrudes out from the PCB, the component must fit
into the margin with 0.5mm clearance as shown in Figure 58.
Figure 58: Protruding component margin gap requirements.
If you already know the design rules, go for pcb fabrication directly!
More Chapters:
1. Brief Introduction
2. Seeed Fusion PCB Specification
3. Panelization and Bridge Design
4. Component Layout Considerations
5. PCB Hole design
6. Solder Mask Design
7. Copper Trace Design
8. Silkscreen Design
9. PCB Lamination Structure
11. Fiducial Mark Design
12. Surface Treatment
13. Files for Manufacture Requirements
14. Appendix
Figure 55: PCB dimensions description.
Table 11: PCB dimensions and weight requirements.
[91] Required PCB width-to-thickness ratio = Y / Z 150.
[92] Required PCB length-to-width ratio = X / Y 2.
[93] For board thicknesses of less than 0.8mm, the copper foil of should be evenly distributed to prevent board bending. If there are many small boards, use of a fixture is recommended.
[94] If the primary side does not meet the clearance area requirements, then the addition of a margin of a width
greater than 5mm, along the direction of travel is recommended.
Figure 56: PCB minimum margin dimensions.
[95] The body of components must not exceed past the edge of the PCB, and must satisfy the following:
The minimum distance from the edge of the solder pad (or component body) to the primary side
must be less than 5mm.
For non-reflow soldering, when a component protrudes out from the PCB, the width of the margin
is as follows:
Figure 57: Protruding component margin requirements.
For non-reflow soldering, when a component protrudes out from the PCB, the component must fit
into the margin with 0.5mm clearance as shown in Figure 58.
Figure 58: Protruding component margin gap requirements.
If you already know the design rules, go for pcb fabrication directly!
More Chapters:
1. Brief Introduction
2. Seeed Fusion PCB Specification
3. Panelization and Bridge Design
4. Component Layout Considerations
5. PCB Hole design
6. Solder Mask Design
7. Copper Trace Design
8. Silkscreen Design
9. PCB Lamination Structure
11. Fiducial Mark Design
12. Surface Treatment
13. Files for Manufacture Requirements
14. Appendix
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