PCB Lamination Structure – PCB DFM Part 9
Layer Structure
[86]The foil stacking structure is recommended.
Description: For PCB lamination, there are generally two design types: Copper foil structure and Core board
structure. The Core board type is used in special multilayered boards and mixed boards.
Figure 53: PCB lamination types.
[87] 0.5oz copper foil is generally used for the copper in the outer layers, whereas 1oz copper foil is generally
chosen for the inner layers. Core boards with asymmetric thicknesses should be avoided in the inner layers.
[88] Symmetrical design considerations include the thickness of pre-preg layers, the type of resin used, the
thickness of the copper foil and the type of layer distribution (copper foil layer, circuit layer). The layout
should be as symmetrical as possible about the symmetry axis.
Figure 54: Symmetrical design diagram
If you’ve mastered the PCB lamination structure rules, take Seeed Fusion pcb prototyping a try now!
More Chapters:
1. Brief Introduction
2. Seeed Fusion PCB Specification
3. Panelization and Bridge Design
4. Component Layout Considerations
5. PCB Hole design
6. Solder Mask Design
7. Copper Trace Design
8. Silkscreen Design
10. PCB Dimensions Specification
11. Fiducial Mark Design
12. Surface Treatment
13. Files for Manufacture Requirements
14. Appendix
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